SHENZHEN BBIEN TECHNOLOGY CO.,LTD

Product DetailsStencil printing SMT red glue epibond adhesives 200ml and 300ml tubeBrief Introduction for SMT red glue epibond adhesivesBBIEN?s stencil printing Surface Mount Adhesives are designed for holding in place bottom side ? and some mixed technology ? surface mount components during the wave soldering process. Epibond?are high-quality non-slumping and non-stringing surface mount technology adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast .Feature of BBIEN red glue adhesive- For Printing and Dispensing Applications,Fast Curing and Non-Stringing Formula- Good for High Speed Placement Equipment- High Shear Strength- Available in Industry Standard Sizes; Non-REACH Compliant??Dispense, print and pin transfer application.??High-visibility red or yellow options.??Room temperature stability, 6-month room temperature shelf life.??Non slumping and non stringing.??Screen printable with BBIEN CUT laser stencils to SMD adhesive guidelines.BBIEN stencil printing SMT surface mount adhesives offer excellent performance for all print and dispensing??Non-slumping and non-stringing.??Room temperature stability.??Dispense, print and pin transfer application.??Consistent dot profile and fact curing.??High-visibility red or yellow options.BBIEN Stencil Epibond?Surface Mount Adhesives Typical Cure ProfileA correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:??Ensure the material is heated to the correct temperature for the specific time.??maximum thermal ramp rate is 1.5 to 2.0?C/second to ensure a homogeneous cure.Printed Adhesive???Sales/support in every major electronics geographic market??Local and consistent technical support regionally and globally??Consistent product performance globallyDispensed AdhesivePart of physical feature and specificationProductsAppearanceviscosityDensityShear StrengthCure TemperatureCure SpeedmPa.sg/cm3mpa?CsRed GlueRed280,000mPa?S(280,000cps)1.3114.6105120-150l? Treating condition:85??85%RH?DC50V?1000hrs.?l? JIS Z3197 Measured at comb electrode model II (G10)?Specification:ItemSMT Red Glue adhesive?CompositionEpoxy resin adhesiveAppearanceTacky Paste/red-coloredSpecific gravity1.31Viscosity at 25?,5rpm280,000mPa?S(280,000cps)Thixotropy index6.8(1rpm/10rpm)Adhesive Strength ?2125CMini-mold trSOP?IC 16P??????????????????????????????44N(4.5kgf)0.2mgr twin45N(4.6kgf)0.3mgr twin92N(9.4kgf)0.8mgf single?2Electric PropertyVolume resistanceInsulation resistanceInitial valueAfter treating*Dielectric constantDielectric loss tangent3.6?1016??cm??? JIS K69111.2?1014? ? ? ? ?JIS Z31971.2?1012?3.12/1MHZ????? JIS K69110.012/1MHZ???? JIS K6911Preservation condition3?~10??To be strictly kept at 3??~10??in refrigeratorMain contentMain Epoxy resin and some(adhesive agent,wetting agent and surfactant?Package style for BBIEN SMT red glue adhesivePackage stylesContentsPack.UnitExport outer packingtube packing200ml;300mlPcs.20-25pcs per cartonFeatures???????????????????????????????1)Much lower temperature curing is aimed at amd is practically possible.2)Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots.3)stable adhesive strength can be obtained with a variety of SMD.4)Long-term preservation stability is expected.5)High heat-resistivity and excellent electric properties are possessed.6)Usable for screen printing.Curing condition?Recommended curing condition: Over 60 sec after PCB?s surface temperature has reached 150?.or over 90 sec after PCB?s surface temperature has reached 120?.?When the higher curing temperature and the longer curing time, the stronger adhesive strength can obtained. We would suggest you to search out an optimum curing condition, for the temperature is different on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs.How to use Red glue adhesive?Adhesive should be preserved in refrigerator (below?5?3?) to keep on its quality.?Before processing, the adhesive should be taken out from the refrigerator for de-freezing about a few hours until it reaching the room temperature.?The bottom of printing screen should be cleaned timely for good printing shape.?Toluene or ethyl acetate is possible to use for cleaning up this adhesive.This product, during handling or use, may be hazardous to health or the environment. Read the Material safety Data Sheet and warning label before using this product.Health & Safety:Consult the MSDS for all safety information. The most recent version of the SDS is available from BBIEN.Inhalation of the flux solvent and volatilized activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture the fumes. Observe precautions during handling and use.Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.Exporte countries:BBIEN stencil Epoxy resin adhesive?have been exported to Vietnam, Bangladesh, Hongkong,SouthKorea,Russia,Japan,India,brazil,Colombia,Argentia?We are appreciated your kindly feedback and inquiries.Products Phtos

•